Friday, June 21, 2013
Tuesday, June 18, 2013
Sunday, June 16, 2013
Tuesday, June 11, 2013
Tuesday, June 4, 2013
Sunday, June 2, 2013
A Maryland energy company is planning to deliver 500 megawatts of power to the electrical grid from a giant hollow tower on the Arizona-Mexico border that would be the second-tallest structure ever built.
The project does seem farfetched, and the company’s stock is trading at a penny a share, down from a high of 32 cents two years ago. But Sharon Williams, the director of development services for the city of San Luis, said the company’s professionalism bespoke a certain seriousness.
Massive Energy Skyscraper Proposed On U.S.-Mexico Border http://www.forbes.com/sites/davidferris/2013/03/26/massive-energy-skyscraper-proposed-on-u-s-mexico-border/
Your Energy Skyscraper Questions, Answered
Saturday, June 1, 2013
ESM was presenting a community energy storage (CES) system comprised of two enclosures that separately house the ABB ESI-S inverter and five GM Chevy Volt batteries. The batteries, which have been in use in the Volt for 8 to 10 years, are capable of holding only 70 percent of their full charge, thereby making them less viable for automotive use. But that remaining capacity, which can discharge power over the span of several hours, has definite benefits as a stationary storage application.
Fabrication of thin-film solar cells (TFSCs) on substrates other than Si and glass has been challenging because these nonconventional substrates are not suitable for the current TFSC fabrication processes due to poor surface flatness and low tolerance to high temperature and chemical processing. Here, we report a new peel-and-stick process that circumvents these fabrication challenges by peeling off the fully fabricated TFSCs from the original Si wafer and attaching TFSCs to virtually any substrates regardless of materials, flatness and rigidness. With the peel-and-stick process, we integrated hydrogenated amorphous silicon (a-Si:H) TFSCs on paper, plastics, cell phone and building windows while maintaining the original 7.5% efficiency. The new peel-and-stick process enables further reduction of the cost and weight for TFSCs and endows TFSCs with flexibility and attachability for broader application areas. We believe that the peel-and-stick process can be applied to thin film electronics as well.