US 20130243143 A1
ESM was presenting a community energy storage (CES) system comprised of two enclosures that separately house the ABB ESI-S inverter and five GM Chevy Volt batteries. The batteries, which have been in use in the Volt for 8 to 10 years, are capable of holding only 70 percent of their full charge, thereby making them less viable for automotive use. But that remaining capacity, which can discharge power over the span of several hours, has definite benefits as a stationary storage application.
Fabrication of thin-film solar cells (TFSCs) on substrates other than Si and glass has been challenging because these nonconventional substrates are not suitable for the current TFSC fabrication processes due to poor surface flatness and low tolerance to high temperature and chemical processing. Here, we report a new peel-and-stick process that circumvents these fabrication challenges by peeling off the fully fabricated TFSCs from the original Si wafer and attaching TFSCs to virtually any substrates regardless of materials, flatness and rigidness. With the peel-and-stick process, we integrated hydrogenated amorphous silicon (a-Si:H) TFSCs on paper, plastics, cell phone and building windows while maintaining the original 7.5% efficiency. The new peel-and-stick process enables further reduction of the cost and weight for TFSCs and endows TFSCs with flexibility and attachability for broader application areas. We believe that the peel-and-stick process can be applied to thin film electronics as well.
More than 100 micro-supercapacitors can be produced on a single disc in 30 min or less.
The new micro-supercapacitors are also highly bendable and twistable, making them potentially useful as energy-storage devices in flexible electronics like roll-up displays and TVs, e-paper, and even wearable electronics. The researchers showed the utility of their new laser-scribed graphene micro-supercapacitor in an all-solid form, which would enable any new device incorporating them to be more easily shaped and flexible. The micro-supercapacitors can also be fabricated directly on a chip using the same technique, making them highly useful for integration into micro-electromechanical systems (MEMS) or complementary metal-oxide-semiconductors (CMOS). As they can be directly integrated on-chip, these micro-supercapacitors may help to better extract energy from solar, mechanical and thermal sources and thus make more efficient self-powered systems. They could also be fabricated on the backside of solar cells in both portable devices and rooftop installations to store power generated during the day for use after sundown, helping to provide electricity around the clock when connection to the grid is not possible.